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    DSASW00187154.pdf

    • Fujitsu
    • BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 21 Sealing method Plastic mold
    • Original
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    DSASW00187154.pdf preview Download Datasheet

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    272-PIN BGA-272P-M01

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