Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA2IH0044140.pdf

    • Not Available
    • C A P A C IT O R S 0.3 PF to 330 PF · Gold Bascked · Aluminum Bonding Pads · Low Leakage Currents High Temperature Stability · Available in Chip or Slice Form The Dionics series of M O S chip capa
    • Scan

    DSA2IH0044140.pdf preview Download Datasheet

    Price & Stock Powered by Findchips
    Supplyframe Tracking Pixel