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DSA00425449.pdf
Manufacturer
Skyworks Solutions
Partial File Text
Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperat
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
Ablebond
Ablebond 8380
Ablestik 8380
APN3001
Die Attach epoxy stamping
FR4 substrate epoxy
FR4 substrate height and thickness
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