DSAZSAA00019973.pdf
- NXP Semiconductors
- Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V
- Original
-
Price & Stock Powered by
Findchips
Findchips