DSA00437240.pdf

Manufacturer Bourns
Partial File Text Ro VER LEA H S SI D F CO ON RE M SA E PL R IA E NT Low profile surface mount packaging Features designed for reflow process (225 ° peak) Lead free versions available Supports 4
Datasheet Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSA00437240.pdf preview Download Datasheet