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DSA0079862.pdf
Manufacturer
Aeroflex
Partial File Text
Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA FEATURES 0.25µm, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes
Datasheet Type
Original
ECAD Model
Part Details
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CERAMIC QUAD FLATPACK CQFP 96
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