DSACRA00005725.pdf

Manufacturer Xilinx
Partial File Text 100% Material Declaration Data Sheet FF484 PK402 (v1.2) September 28, 2012 Average Weight: 4.1856g Component Silicon Die (FPGA) Doped silicon Solder Bump Tin Lead Die Underfill Bisphenol F-type l
Datasheet Type Original
ECAD Model
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DSACRA00005725.pdf preview Download Datasheet