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DSAZSAA00020090.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm (Backside coating included) B A D NX5P1000 A2 ball A1 index area A E A1 detail X
Type
Original
ECAD Model
Part Details
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