The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA0088974.pdf
Manufacturer
-
Partial File Text
Thermal Data SDIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue
Datasheet Type
Original
ECAD Model
DSA0088974.pdf preview
Download Datasheet