DSAZSAA00020271.pdf
- NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder
- Original
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