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DSA005171.pdf
Manufacturer
Bergquist
Partial File Text
® Gap Pad HC1000 "Gel-Like" Modulus Gap Filling Material Features and Benefits Typical Properties of Gap Pad HC1000 Property · Thermal conductivity 1.0 W/m-K Imperial Value Metric Va
Datasheet Type
Original
ECAD Model
Part Details
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ASTM d792
D2240
hc 1000
HC100
HC1000
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