The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA0018349.pdf
Manufacturer
Hewlett-Packard
Partial File Text
H GaAs MMIC Assembly and Handling Guidelines Application Note 999 Mechanical Considerations Because of the small size of the devices, handling should always be performed with the aid of a
Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA0018349.pdf preview
Download Datasheet
User Tagged Keywords
AuSn solder
bonder
GaAs MMIC ESD, Die Attach and Bonding Guidelines
KCW-10
thermocompression
Price & Stock Powered by
Findchips