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DSARS0027796.pdf
Manufacturer
Altera
Partial File Text
Altera Device Package Information 400-Pin Wirebond FineLine Ball-Grid Array (FBGA) All dimensions and tolerances conform to ANSI Y14.5M 1994. Controlling dimension is in millimeters. M
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
JEDEC FBGA 11
MS-034