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    DSA00182112.pdf

    • Skyworks Solutions
    • APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in
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    DSA00182112.pdf preview Download Datasheet

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    Ablebond 8380 APN3001 Die Attach epoxy stamping

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