The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSADIGA000109410.pdf
Manufacturer
Bergquist
Partial File Text
Gap Pad HC1000 ® âGel-Likeâ Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color ⢠Thermal conductivity: 1.0 W/m-K ⢠Highly con
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSADIGA000109410.pdf preview
Download Datasheet