Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00508995.pdf

    • STATS ChipPAC
    • QFP-SD Stacked Die Quad Flat Pack · Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION · Combining devices into one package red
    • Original
    • Price & Stock Powered by Findchips

    DSA00508995.pdf preview Download Datasheet

    User Tagged Keywords

    32 QFP PACKAGE thermal resistance 64 leads qfp AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray STATS ChipPAC Techpoint

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel