Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAZSAA00016219.pdf

    • NXP Semiconductors
    • Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball A1 index area A A2 E A1 detail X
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAZSAA00016219.pdf preview Download Datasheet

    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel