The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA0057181.pdf
Manufacturer
-
Partial File Text
PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA960: plastic, heatsink ball grid array package; 960 balls; body 33 x 33 x 2.4 mm SOT683-1 B D A D1 ball A1 index
Datasheet Type
Original
ECAD Model
DSA0057181.pdf preview
Download Datasheet
User Tagged Keywords
HBGA960
MS-034
sot683