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DSAZSAA00020275.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline Footprint information for reflow soldering of HXSON16 package SOT1159-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx S
Datasheet Type
Original
ECAD Model
Part Details
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