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DSAZIHA2X00062596.pdf
Manufacturer
Micrel Semiconductor
Partial File Text
Reportable Substances in Components Package Type : Component Weight : MLF(2X2mm Sawn) Document No : Lead #: 8 Process Type : No 1 Material Molding Compound Content in % 9.33% Conten
Datasheet Type
Original
ECAD Model
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