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DSA0019280.pdf
Manufacturer
Fairchild Semiconductor
Partial File Text
Application Note 7006 June 2004 Guidelines for Using Fairchild's SO-8 FLMP Dennis Lang, Applications Engineer Introduction The Flip chip in Leaded Molded Package (FLMP) SO-8 minimizes both Pr
Datasheet Type
Original
ECAD Model
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FDS7066N3
FDS7066N7
IPC-9502
IPC9502
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