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    DSAUTAZ001062.pdf

    • Advanced Micro Devices
    • TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' )ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array (FBGA) The FBGA package offers syst
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