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    DSAZSAA00019992.pdf

    • NXP Semiconductors
    • Package outline HLQFN64R; plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 × 9 × 1.6 mm A B D SOT903-1 terminal 1 index area A
    • Original
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    DSAZSAA00019992.pdf preview Download Datasheet

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