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    DSASCANS15-62937.pdf

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    • RevNo A L 1. Wafer Material: PA 66+20%GF UL94V-0 W ave soldering temperature limit: 260°C ±5,10±0.5Sec. Contact Material: Copper Alloy 2. Plated: Tin-plated 50u"min. 3. Insulation resist
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