DSA2IH009594.pdf

Manufacturer Not Available
Partial File Text L O P A K M O D U L E S - LoProfile com pact packaging - LoLoss rugged IGBT chip-set - LoSystem assembly time drop-on bus bars, snap-on PCB - Complete inverter range with three packages - Cu-based
Datasheet Type Scan
ECAD Model

DSA2IH009594.pdf preview Download Datasheet