The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DASF001825.pdf
Manufacturer
Avago Technologies
Partial File Text
HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DASF001825.pdf preview
Download Datasheet
User Tagged Keywords
BGA Ball Crack
BGA cte
BGA PACKAGE thermal profile
BGA Solder Ball 1mm
bga thermal cycling reliability
entek Cu-56
fine BGA thermal profile
JEDEC SMT reflow profile
pcb warpage* in smt reflow
Solder Paste Indium reflow process control
Solder Paste, Indium reflow process control
Solder Paste, Indium, Type 3
Price & Stock Powered by
Findchips