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    DSAZSAA00019994.pdf

    • NXP Semiconductors
    • Package outline TFBGA84: plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm B D SOT904-1 A ball A1 index area A E A2 A1 detail X e1 ∅v
    • Original
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    DSAZSAA00019994.pdf preview Download Datasheet

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