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DSAE0032001.pdf
Manufacturer
Freescale Semiconductor
Partial File Text
Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead (QFN) Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed
Datasheet Type
Original
ECAD Model
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0.65mm pitch BGA
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FOOTPRINT MO-229 2X3 SOLDERING
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