Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA2IH0074360.pdf

    • Not Available
    • Direct Copper Bonded (DCB) Ceramic Substrates Uncladed ceramic Purity Dielectric strength Electrical resistivity Thermal conductivity Dimensions Thickness Alum inium O xid e >96% 10 kV/mm >101
    • Scan

    DSA2IH0074360.pdf preview Download Datasheet

    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel