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DSA00299936.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP316V Small Signal Transistors NPN - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 7.1 MILS Base Bondi
Datasheet Type
Original
ECAD Model
Part Details
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2N5551
2n5551 chip
CMPT5551
CP316V
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