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DSA00269312.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPD48V Schottky Diode High Current Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14 x 14 MILS Die Thickness 7.1 MILS Anode Bonding Pad Area
Datasheet Type
Original
ECAD Model
Part Details
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DSA00269312.pdf preview
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"Schottky Diode"
CPD48V
DIODE 3T
high current schottky diode
Schottky diode wafer
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