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DSA00305735.pdf
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Quality Evaluation Data for Lead-free SMD Peripheral Packages (Sn-Bi plating) August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plati
Type
Original
ECAD Model
DSA00305735.pdf preview
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bi 240
epson, whisker
NA-200
NA200
NA200 flux
paste profile
QFP 128 bonding
QFP 208
QFP PACKAGE thermal resistance
QFP-208
SMD Packages
SnAgCu