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DSAEDA00058928.pdf
Manufacturer
Bergquist
Partial File Text
Gap Pad 2200SF ® Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2200SF PROPERTY Color ⢠Thermal conductivity: 2.0 W/m-K â
Datasheet Type
Original
ECAD Model
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