DSAZSAA00020090.pdf
- NXP Semiconductors
- Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm (Backside coating included) B A D NX5P1000 A2 ball A1 index area A E A1 detail X
- Original
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