High Density GHz BGA Sockets; Max Pincount: 256; Top Pitch (mm): 0.5; IC Array X: 16; IC Array Y: 16; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.83; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.18; IC Ball Height Max (mm): 0.28; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-HD
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