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DSA00160697.pdf
Manufacturer
-
Partial File Text
HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawi
Datasheet Type
Original
ECAD Model
DSA00160697.pdf preview
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User Tagged Keywords
22-N-4
ultra fine pitch BGA