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    DSA0025162.pdf

    • Fujitsu
    • LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 Lead pitch 50mil Package width × package length 450 × 550mil Sealing method Metal seal 32-pad cer
    • Original
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    DSA0025162.pdf preview Download Datasheet

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    64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1

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