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    DSAZSAA00020483.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XSON6 package SOT886 1.250 0.675 0.370 (6×) 0.500 1.700 0.500 0.270 (6×) 0.325 (6×) 0.425 (6×)
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    DSAZSAA00020483.pdf preview Download Datasheet

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