The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAUD0079975.pdf
Manufacturer
NXP Semiconductors
Partial File Text
AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 -- 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSAUD0079975.pdf preview
Download Datasheet
User Tagged Keywords
AN10778
JEDEC bga case outline
land pattern for TSOP 2 54 pin
LBGA256
LFBGA256
LFBGA324
LPC175x
LPC178
LPC185
LPC2220
LPC2292
LPC2364
LPC2368
LPC2458
LPC2468
LPC2468 reflow solder profile
LPC2470
LPC2478
LPC2478 pcb
LPC2880
LPC2888
LPC3130
lpc433x
MO-216
MO-275
NXP lpc
nxp lpc175x
pcb design 0,5 mm pitch
PCB layout guidelines for NXP MCUs in BGA packages
SOT950-1
TFBGA-296
TSOP 54 land pattern
via antipad pitch