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DSAZSAA00019472.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline WLCSP6: wafer level chip-size package; 6 bumps (2 x 3) IP3319CX6 bump A1 index area D A1 E A detail X e b C e e1 B A 1 2 X 0 1 mm scale
Datasheet Type
Original
ECAD Model
Part Details
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