DSAZSAA00020481.pdf
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NXP Semiconductors
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Reflow soldering footprint
Footprint information for reflow soldering of QFN3333-8 package
SOT873-1
2.35
2.25
0.635
0.75
0.617
0.05 (all around)
0.62
1.05
1.91
2.47
0.51
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Original
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Part pricing, stock, data attributes from Findchips.com
Findchips