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    DSAISS0006686.pdf

    • Central Semiconductor
    • PROCESS CPD26 Fast Recovery Rectifier 8 Amp Glass Passivated Rectifer Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 100 x 100 MILS Die Thickness 11 MILS An
    • Original
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    DSAISS0006686.pdf preview Download Datasheet

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