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DSAISS0006686.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPD26 Fast Recovery Rectifier 8 Amp Glass Passivated Rectifer Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 100 x 100 MILS Die Thickness 11 MILS An
Datasheet Type
Original
ECAD Model
Part Details
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