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    DSA00269316.pdf

    • Central Semiconductor
    • PROCESS CPD77 Schottky Rectifier 3.0A Schottky Barrier Rectifier Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 61 x 61 MILS Die Thickness 9.8 MILS Anode Bonding P
    • Original
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    DSA00269316.pdf preview Download Datasheet

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    CPD77 CTLSH3-30M833
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