DSA2IH00138076.pdf

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Partial File Text Philips Semiconductors Short-form objective specification GSM signal processing 1C FEATURES · Fabricated in a 0.5 nm/0.4 urn C M O S process with 3-layer metal · L Q F P 1 28 package · 3.3 V o
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DSA2IH00138076.pdf preview Download Datasheet