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DSA00299935.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP315V Power Transistors NPN - High Current Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 40 X 40 MILS Die Thickness 7.1 MILS Base Bonding Pad Ar
Datasheet Type
Original
ECAD Model
Part Details
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CP315V
CXT3150
CZT3150