Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00296627.pdf

    • -
    • Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S
    • Original

    DSASW00296627.pdf preview Download Datasheet

    User Tagged Keywords

    Cu3Sn Cu6Sn5 Cu6Sn5 formation DE-AC03-76SF00098 Ortec sncu0.7 whisker Cu base

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel