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    DSASW00187139.pdf

    • Fujitsu
    • FLIP CHIP BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 1196 PIN CERAMIC BGA-1196C-M01 1196-pin ceramic FCBGA Lead pitch 1.00 mm Package width × package length 37.50 × 37.50
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    DSASW00187139.pdf preview Download Datasheet

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