DSA2IH00130178.pdf

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Partial File Text O K I Semiconductor Packaging Packaging DtP40-P-600-2.54 5 1 .9 8 * 0 .3 (Unit, mm) Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) DIP42-P-6
Datasheet Type Scan
ECAD Model

DSA2IH00130178.pdf preview Download Datasheet