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DSA0013395.pdf
Manufacturer
Intersil
Partial File Text
Thermal Characterization of Packages for ICs Technical Brief December 1999 TB379.1 Author: Michael Colquitt Introduction Any operating semiconductor device will produce heat as a by-produ
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
G30-88
JESD-51
JESD-51-1
JESD51
JESD51-1
JESD51-5
JESD51-7
TB379
thermal resistance standards