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    DSAUD0010718.pdf

    • Laird Technologies
    • TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE TflexTM 300, at pressures of 50psi, will deflect
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    • Part pricing, stock, data attributes from Findchips.com

    DSAUD0010718.pdf preview Download Datasheet

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    ASTM 5470 GAP FILLER D2240 THR-DS-TFLEX-300
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